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Tata Electronics to begin chip packaging in Assam

Tata Electronics is preparing to start semiconductor chip packaging operations at its upcoming plant in Assam, taking another step in India’s push to build a stronger domestic electronics and technology ecosystem.

The upcoming facility is expected to handle the packaging and testing of semiconductor chips, an important stage in the manufacturing process where chips are assembled and prepared for use in devices such as smartphones, laptops, automobiles and other electronic products.

The project is seen as an important move not just for the company, but also for India’s larger goal of reducing dependence on imported semiconductor components. Over the past few years, countries around the world have focused on strengthening local chip production after global supply disruptions exposed vulnerabilities in technology supply chains.

Semiconductors have become a critical part of modern life and power everything from mobile phones and consumer electronics to vehicles and industrial systems. As demand for electronic products continues to rise globally, the need for stronger semiconductor manufacturing capabilities has also increased.

The Assam unit is also expected to bring economic benefits to the region. Industry observers believe the project could generate employment opportunities, create demand for skilled workers and encourage the growth of supporting industries around the facility. Large technology projects often attract related businesses and investments, which can contribute to regional development.

This upcoming project aligns with India’s broader efforts to establish itself as a major manufacturing hub. Government initiatives and policy support for the semiconductor sector have encouraged companies to invest in local production and advanced technology infrastructure.

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Corporate

Qualcomm and Tata Electronics to make automotive modules in India

Qualcomm Technologies,  has partnered with Tata Electronics to manufacture Qualcomm Automotive Modules in India, a move aimed at boosting local production and supporting the country’s growing automotive electronics sector.

Tata Electronics will produce these modules at its upcoming semiconductor assembly and test facility in Jagiroad, Assam — India’s first indigenous Outsourced Semiconductor Assembly and Test (OSAT) plant. The facility, with an estimated investment of around USD 3 billion, will focus on advanced packaging technologies including wire bonding, flip-chip, and integrated systems packaging, which are crucial for automotive, AI, IoT, and communication electronics.

Qualcomm Automotive Modules combine Snapdragon Digital Chassis chips with essential system components into production-ready units. These modules simplify design for automakers, enabling faster development of digital cockpits, infotainment, connectivity, and intelligent vehicle systems. They are also key to the shift toward software-defined vehicles, providing scalable, ready-to-use solutions.

This collaboration aligns with India’s Make in India initiative and global efforts to diversify semiconductor supply chains. By manufacturing locally, Qualcomm and Tata Electronics aim to serve both Indian and international automakers more efficiently while enhancing supply-chain resilience.

Executives from Qualcomm highlighted the growing global demand for automotive modules and the importance of regional manufacturing hubs. For Tata Electronics, the partnership marks a major milestone in its ambition to become a global center for advanced electronics manufacturing, leveraging its expertise in integrated systems packaging to deliver high-performance products.

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