Samsung Electronics is nearing certification from Nvidia for its next‑generation HBM4 high-bandwidth memory, a key component for AI processors, according to industry sources. The approval would allow Samsung to supply these advanced chips, strengthening its position in the rapidly growing AI hardware market.
HBM4 memory, a stacked DRAM technology, delivers extremely high data bandwidth and energy efficiency, crucial for feeding large volumes of data into Nvidia’s AI accelerators. Nvidia has relied mainly on SK Hynix for HBM memory, making Samsung’s entry a notable shift in the supply chain.
Reports indicate Samsung is in the final stage of testing after submitting initial HBM4 samples late last year. The company aims to begin mass production in February 2026, with shipments expected soon after certification. Positive feedback from customers on Samsung’s HBM4 design highlights its competitiveness in performance and reliability.
The development has already boosted investor confidence. Samsung’s shares in Seoul gained on news of the potential approval, as analysts see it as a step toward diversifying the supply of high-end AI memory and challenging SK Hynix’s dominance.